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HOME > Products > Surface Treatment > Machining processes > Chipping

Chipping

Our surface treatment solutions can be applied for shaving off matter from your product's surface for various purposes:

Application

  • Patterning
  • Grooving
  • 3D Machining
  • Beveling
  • Boring
  • Etching
  • Embossing

and many more.

Before

Fine processing such as 50μm hole or ditch process on crustaceous matrrials like glass,ceramics and slicon.

Before

Fine processing with less chipping or crack on crustaceous materials like glass

Result and function

  • Functional part forming
  • Ornamentation

Examples of processing

Etching of Glass wafer

ガラス基板の穴加工(穴径:200μm)

ガラス基板の穴加工(穴径:200μm)

Hole process (Ceramics)

ガラスウェハの穴加工(穴径:200μm)

ガラスウェハの穴加工(穴径:200μm)

3D Micro process (Glass plate)

ガラスウェハの穴加工(穴径:200μm)

ガラスウェハの穴加工(穴径:200μm)

Ditch process (Glass plate)

ガラスウェハの穴加工(穴径:200μm)

ガラスウェハの穴加工(穴径:200μm)

Machines used for boring, grooving, etching, embossing and their features / Features of the process

Machines Features of the process
Microblasting machines
  • The dry process uses no chemicals.
  • Less likely to cause chipping and cracking.
  • Less likely to affect the product quality.
  • A higher blasting rate.
  • Capable of blasting surfaces with complicated shapes.
  • A lower initial cost.

Please consult us for surface treatment-related.

(81)52-582-9217 +81-52-581-6896

Reception hours: 9:00 to 12:00 and 13:00 to 17:00 on Monday through Friday
(excluding national and corporate holidays)

Please enter your question here.

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