Dimensional Measurements of IC Package
IC packaging technology is rapidly becoming high-density and three-dimensional due to the accelerating advance of semiconductor functionality. Sinto's dimensional measurement technology is applied to the manufacturing process of IC package substrates, represented by the state-of-the-art high-density FC-BGA.
Measurement of FC-BGA Packages
Measurement Outline
Mainly measures the electrical connection between the BGA board and the IC side or outside. Since not only the measurements of position and diameter of the area where the bumps connect, but also of the uniform height of the bumps become important, an optional laser auto focus displacement meter is used to measure the height of the land before the molding of the bumps and the uniformity (co-planarity) of the height of the bumps after molding.
Measurement of Lead Frame
A component called a lead frame, which is made from the processing of the thin metal sheet and acts as a connection between the IC and the outside part, is used in IC packages. Advancements are being made year by year to the intricacy of the inner lead in particular, which is the component connecting to the IC side. This makes the measurement of this part increasingly important.
Measurement Outline
Measurements are made of the width and spacing of the inner and outer leads and of the dimensions of the IC mounted area (Die Pad ). Measurement of width and spacing of the part requested by a user is possible through a special measurement program used especially during measurement of the inner lead
Measurement of Photomask
Photolithography technology is used for the patterning of high-density packaging components, whereby patterns are baked onto a glass base plate. We measure the pattern position, line width / space and diameter of photomasks, which are mainly used as original plates. The optional software C-Auto enables the creation of measurement program based on CAD data, which is pattern design data, to improve work efficiency.
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